Thermally-Latent Curing Agents for Epoxy Resins: A Review

Document Type : Review

Authors

1 1. Department of Chemical Engineering, Faculty of Engineering, Mazandaran University, P.O. Box 47416-13534, Mazandaran, Iran

2 Department of Composites, Faculty of Processing, Iran Polymer and Petrochemical Institute, P.O. Box: 14975-112, Tehran, Iran

Abstract

Epoxy resins are widely used in composites, aerospace, construction, electronic, adhesive and coatings industries due to their high physical and mechanical, thermal resistance, electrical and chemical properties. For curing epoxy resins, a chemical material, called curing agent or hardener, must be used. Curing agents have strong effect on the processing conditions and final properties of the cured resins. In general, epoxy curing agents can be classified in two groups of normal (room or high temperature) and latent curing agents. Normal curing agents increase the resin viscosity at room temperature due to crosslinking or curing reactions and the resin is gelled and finally cured. The rate of viscosity increment would be different and depends on the kind of curing agent. On the other hand, latent curing agents cannot react with epoxy resin at room temperature and do not increase the resin viscosity. Therefore, they are being used for preparing one-part epoxy resins. Latent curing agents are not active at room temperature, but they will react with epoxy resin by the application of an external force like heat or light. Thermally-latent curing agents are well-known and they are widely used. They include substances with active hydrogen, and are catalyzed and protected by chemical groups and microcapsules. Selection of a latent curing system for an application is an important issue which affects the processing conditions and final properties of the cured resins. In this paper, the latest achievements in this area are reviewed.

Keywords

References

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Iranian Journal of Polymer Science and Technology
Volume 31, Issue 5 - Serial Number 157
January and February 2019
Pages 409-426

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